rt-thread-official/bsp/microchip/saml10
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README.md

SAML10E16A BSP Introduction

中文

  • MCU: ATSAML10E16A @32MHz, 64KB FLASH, 16KB RAM, 1.62V 3.63V
  • L10: Cortex-M23 + Hardware multiplier & divider + ultra low power(< 25 μA/MHz)
  • Pin: E=32 pins, D=24pins
  • Flash: 16=64KB, 15=32KB, 14=16KB(size=2^n)
  • SRAM : 16KB(Flash 64KB), 8KB(Flash 32KB), 4KB(Flash 16KB)
  • Datasheet: https://www.microchip.com/en-us/product/ATSAML10E16A

KEY FEATURES

Core

  • 32 MHz (2.64 CoreMark/MHz and up to 31 DMIPS) Arm® Cortex®-M23 with:
  • Single-cycle hardware multiplier
  • Hardware divider
  • Nested Vector Interrupt Controller (NVIC)
  • Memory Protection Unit (MPU)
  • Stack Limit Checking
  • TrustZone® for ARMv8-M (optional)

Memories

  • 16/32/64-KB Flash
  • 4/8/16-KB SRAM
  • 2-KB Data Flash Write-While-Read (WWR) section for non-volatile data storage
  • 256 bytes TrustRAM with physical protection features

System

  • Power-on Reset (POR) and programmable Brown-out Detection (BOD)
  • 8-channel Direct Memory Access Controller (DMAC)
  • 8-channel event system for Inter-peripheral Core-independent Operation
  • CRC-32 generator

Clock Management

  • Flexible clock distribution optimized for low power
  • 32.768 kHz crystal oscillator
  • 32.768 kHz ultra low-power internal RC oscillator
  • 0.4 to 32 MHz crystal oscillator
  • 16/12/8/4 MHz low-power internal RC oscillator
  • Ultra low-power digital Frequency-Locked Loop (DFLLULP)
  • 32-96 MHz fractional digital Phase-Locked Loop (FDPLL96M)
  • One frequency meter
  • Low-Power and Power Management
  • Active, Idle, Standby with partial or full SRAM retention and off sleep modes:
  • Active mode (< 25 μA/MHz)
  • Idle mode (< 10 μA/MHz) with 1.5 μs wake-up time
  • Standby with Full SRAM Retention (0.5 μA) with 5.3 μs wake-up time
  • Off mode (< 100 nA)
  • Static and dynamic power gating architecture
  • Sleepwalking peripherals
  • Two performance levels
  • Embedded Buck/LDO regulator with on-the-fly selection

Security

  • Up to four tamper pins for static and dynamic intrusion detections
  • Data Flash
  • Optimized for secure storage
  • Address and data scrambling with user-defined key (optional)
  • Rapid tamper erase on scrambling key and on one user-defined row
  • Silent access for data read noise reduction
  • TrustRAM
  • Address and data scrambling with user-defined key
  • Chip-level tamper detection on physical RAM to resist microprobing attacks
  • Rapid tamper erase on scrambling key and RAM data
  • Silent access for data read noise reduction
  • Data remanence prevention
  • Peripherals
  • One True Random Generator (TRNG)
  • AES-128, SHA-256, and GCM cryptography accelerators (optional)
  • Secure pin multiplexing to isolate on dedicated I/O pins a secured communication with external devices from the non-secure application (optional)
  • TrustZone for flexible hardware isolation of memories and peripherals (optional)
  • Up to six regions for the Flash
  • Up to two regions for the Data Flash
  • Up to two regions for the SRAM
  • Individual security attribution for each peripheral, I/O, external interrupt line, and Event System Channel
  • Secure Boot with SHA-based authentication (optional)
  • Up to three debug access levels
  • Up to three Chip Erase commands to erase part of or the entire embedded memories
  • Unique 128-bit serial number
  • SAM L11 Securely Key Provisioned (KPH) (optional)
  • Key Provisioning using Root of Trust flow
  • Security Software Framework using Kinibi-M™ Software Development Kit (SDK)

Advanced Analog and Touch

  • One 12-bit 1 Msps Analog-to-Digital Converter (ADC) with up to 10 channels
  • Two Analog Comparators (AC) with window compare function
  • One 10-bit 350 kSPS Digital-to-Analog Converter (DAC) with external and internal outputs
  • Three Operational Amplifiers (OPAMP)
  • One enhanced Peripheral Touch Controller (PTC):
  • Up to 20 self-capacitance channels
  • Up to 100 (10x10) mutual-capacitance channels
  • Low-power, high-sensitivity, environmentally robust capacitive touch buttons, sliders, and wheels
  • Hardware noise filtering and noise signal desynchronization for high conducted immunity
  • Driven Shield Plus for better noise immunity and moisture tolerance
  • Parallel Acquisition through Polarity control
  • Supports wake-up on touch from Standby Sleep mode

Communication Interfaces

  • Up to three Serial Communication Interfaces (SERCOM) that can operate as:
  • USART with full-duplex and single-wire half-duplex configuration
  • I2C up to 3.4 Mbit/s (High-Speed mode) on one instance and up to 1 Mbit/s (Fast-mode Plus) on the second instance
  • Serial Peripheral Interface (SPI)
  • ISO7816 on one instance (Available on 32-pin packages only)
  • RS-485 on one instance (Available on 32-pin packages only)
  • LIN Slave on one instance (Available on 32-pin packages only)
  • Timers/Output Compare/Input Capture
  • Three 16-bit Timers/Counters (TC), each configurable as:
  • One 16-bit TC with two compare/capture channels
  • One 8-bit TC with two compare/capture channels
  • One 32-bit TC with two compare/capture channels, by using two TCs
  • 32-bit Real-Time Counter (RTC) with clock/calendar functions
  • Watchdog Timer (WDT) with Window mode
  • Input/Output (I/O)
  • Up to 25 programmable I/O lines
  • Eight external interrupts (EIC)
  • One non-maskable interrupt (NMI)
  • One Configurable Custom Logic (CCL) that supports:
  • Combinatorial logic functions, such as AND, NAND, OR, and NOR
  • Sequential logic functions, such as Flip-Flop and Latches

Qualification

  • AEC-Q100 Grade 1 (-40°C to 125°C)
  • Class-B safety library, IEC 60730 (future)

Packages

  • 24-pin VQFN(4*4mm/17 I/O pins)
  • 32-pin VQFN(5*5mm/25 I/O pins)
  • 32-pin TQFP(7*7mm/17 I/O pins)
  • 32-pin WLCSP(2.79*2.79mm/25 I/O pins)

Board info