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Jesper Smith d8c5620768

Increased size of EEPROM buffer in eepromtool.c

This PR increases the size eepromtool can read/write to 4 megabit, which is the maximum slave devices seem to support according to the datasheets.

Due to space constraints on our device we store some application specific data on our slave that exceeds 32kbyte, hence the need for the ability to read/write larger images to EEPROM.

2018-06-21 09:15:22 +02:00

cmake

Integrate SOEM with RTEMS

2018-01-23 17:07:59 +01:00

doc

Create and v1.3.3 (skip v1.3.2 due to mistake)

2018-02-02 09:11:17 +01:00

osal

Integrate SOEM with RTEMS

2018-01-23 17:07:59 +01:00

oshw

Integrate SOEM with RTEMS

2018-01-23 17:07:59 +01:00

soem

Fixed windows x64 warning C4267 conversion from size_t to uint16

2018-02-22 15:01:44 -08:00

test

Increased size of EEPROM buffer in eepromtool.c

2018-06-21 09:15:22 +02:00

.gitattributes

Normalize line endings (#126 )

2017-08-16 20:07:39 +02:00

.gitignore

delete derived resources

2016-02-16 14:16:00 +01:00

.travis.yml

Automated builds (#122 )

2017-08-07 17:33:08 +02:00

appveyor.yml

Automated builds (#122 )

2017-08-07 17:33:08 +02:00

ChangeLog

Create and v1.3.3 (skip v1.3.2 due to mistake)

2018-02-02 09:11:17 +01:00

CMakeLists.txt

Fixed windows x64 link path

2018-02-22 12:12:59 -08:00

Doxyfile

Create and v1.3.3 (skip v1.3.2 due to mistake)

2018-02-02 09:11:17 +01:00

drvcomment.txt

Added SOEM 1.3 (hg: a02cedcbdca5)

2014-11-25 16:10:29 +01:00

LICENSE

Normalize line endings (#126 )

2017-08-16 20:07:39 +02:00

README.md

Automated builds (#122 )

2017-08-07 17:33:08 +02:00

README.md

Simple Open EtherCAT Master Library

BUILDING

Prerequisites for all platforms

CMake 2.8.0 or later

Windows (Visual Studio)

Start a Visual Studio command prompt then:
- mkdir build
- cd build
- cmake .. -G "NMake Makefiles"
- nmake

Linux

mkdir build
cd build
cmake ..
make

Want to contribute to SOEM or SOES?

If you want to contribute to SOEM or SOES you will need to sign a Contributor License Agreement and send it to us either by e-mail or by physical mail. More information is available in the PDF.