2023-11-09 14:20:27 +08:00

42 lines
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(footprint "EPC10_N2" (version 20221018) (generator pcbnew)
(layer "F.Cu")
(attr smd)
(fp_text reference "REF**" (at 0.1 -5.5 unlocked) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 97cde6f4-1743-4ba2-af5c-f8de4749d587)
)
(fp_text value "EPC10_N2" (at 0 1 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 6c9b1f6e-20da-4fee-9fbb-0e801b8483d8)
)
(fp_line (start -4.3 -3.7) (end -6.5 -3.7)
(stroke (width 0.12) (type default)) (layer "F.SilkS") (tstamp 9f56852b-b7ab-4ab7-807c-f9f506dcf3d2))
(fp_rect (start -4.3 -5.05) (end 4.3 5.05)
(stroke (width 0.12) (type default)) (fill none) (layer "F.SilkS") (tstamp 3ec240f0-37f1-4889-b205-a492d65dbe9b))
(fp_line (start -6.8 -3.8) (end -4.5 -3)
(stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp e4700820-6781-4782-810b-ece3dc3642d5))
(fp_line (start -4.5 -3) (end -6.8 -2.3)
(stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp 3c7a6d9c-3064-4144-9398-33c1bedbf8ff))
(fp_rect (start -6.8 -5.4) (end 6.8 5.4)
(stroke (width 0.05) (type default)) (fill none) (layer "F.CrtYd") (tstamp 79dcb3c0-fcd3-4f4e-bfa7-72e9d55b9fe4))
(pad "1" smd rect (at -5.55 -3) (size 2 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp d60f8082-b811-4d9e-8423-4bb526415712))
(pad "3" smd roundrect (at -5.55 1) (size 2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
(thermal_bridge_angle 45) (tstamp 3bb51abc-2ad6-4d2a-bc8c-c87dd2aafc79))
(pad "4" smd roundrect (at -5.55 3) (size 2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
(thermal_bridge_angle 45) (tstamp 4d36a4e3-d5c1-4977-af83-01a7fe81a785))
(pad "5" smd roundrect (at 5.55 3) (size 2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
(thermal_bridge_angle 45) (tstamp 80ea1469-cfb7-443b-a287-7fbc790848cb))
(pad "6" smd roundrect (at 5.55 1) (size 2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
(thermal_bridge_angle 45) (tstamp f4088e1e-48ce-4f7b-817f-34ceb8a9c449))
(pad "7" smd roundrect (at 5.55 -1) (size 2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
(thermal_bridge_angle 45) (tstamp 007d6b1f-2dd5-479b-a832-4995e56915f1))
(pad "8" smd roundrect (at 5.55 -3) (size 2 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
(thermal_bridge_angle 45) (tstamp e8ee6961-b576-449f-b056-93b99429010e))
(model "E:/Wrk/pcb/kicad/tj-kicad-lib/3d/EPC10.STEP"
(offset (xyz -7.5 -0.25 3.4))
(scale (xyz 1 1 1))
(rotate (xyz 90 180 90))
)
)